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Title:
RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2017/126661
Kind Code:
A1
Abstract:
Provided are: a resin composition having excellent fluidity, whereby a molded article having high hardness can be obtained; a molded article obtained by curing the resin composition; and a method for manufacturing a molded article. Provided is a resin composition including 10 wt% to 40 wt% of component (a), 60 wt% to 89 wt% of component (b), 1 wt% to 10 wt% of component (c), and 0.01 wt% to 5 wt% of component (d). Component (a): an unsaturated monomer (I) having at least two radical-polymerizable double bonds in each molecule thereof, or a mixture of the unsaturated monomer (I) and an unsaturated monomer (II) which is copolymerizable with the unsaturated monomer (I). Component (b): a glass filler having a median diameter of 1 µm to 20 µm. Component (c): cross-linked resin particles. Component (d): a radical polymerization initiator.

Inventors:
NAKAHARA RYO (JP)
WATANABE NOBUFUMI (JP)
Application Number:
PCT/JP2017/001941
Publication Date:
July 27, 2017
Filing Date:
January 20, 2017
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08F2/44
Domestic Patent References:
WO1998051743A11998-11-19
Foreign References:
JPH09302009A1997-11-25
JPH0820620A1996-01-23
JP2014152191A2014-08-25
JPH10212393A1998-08-11
JPS6345160B21988-09-08
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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