RESIN COMPOSITION, RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE

Title:

RESIN COMPOSITION, RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2018/168789

Kind Code:

A1

Abstract:

The present invention relates to a resin composition, a resin molded article and a method for producing a resin molded article, the resin composition comprising: at least one near-infrared absorbing dye selected from compounds represented by general formula (1); and a resin, wherein the content of the near-infrared absorbing dye is 0.3-5 mass% with respect to the total amount of the resin composition. Details of the reference symbols of the compound are same as described in the specification.

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Inventors:

SASAKI DAISUKE (JP)
JIMBO YOSHIHIRO (JP)

Application Number:

PCT/JP2018/009558

Publication Date:

September 20, 2018

Filing Date:

March 12, 2018

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Assignee:

FUJIFILM CORP (JP)

International Classes:

C08L101/00; C08J5/00; C08K5/3415; C08L67/00; C08L75/04; C08L77/00; D01F1/04; D01F6/92

Domestic Patent References:

WO2016035695A1	2016-03-10
WO2017146092A1	2017-08-31
WO2018056127A1	2018-03-29

Foreign References:

JP2014240371A	2014-12-25
JP2017181705A	2017-10-05

Attorney, Agent or Firm:

TAIYO, NAKAJIMA & KATO (JP)

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