Title:
RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/045032
Kind Code:
A1
Abstract:
[Problem] To provide: a resin composition for a bump-off molded article with which it is possible to prevent deformations from remaining in a molded article after release even when released from the mold by bump-off, the resulting molded article having exceptional rigidity; a bump-off molded article in which the resin composition is used; and a method for producing the same. [Solution] A resin composition for a bump-off molded article in which the flexural modulus at 23°C is 8 GPa or higher and the flexural modulus at 150°C is less than 40% of the flexural modulus at 23°C. The flexural modulus at 150°C is preferably 5 GPa or less.
Inventors:
FUJITA TAKASHI (JP)
YAMANE KEISUKE (JP)
YAMANE KEISUKE (JP)
Application Number:
PCT/JP2018/032288
Publication Date:
March 07, 2019
Filing Date:
August 31, 2018
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L101/00; B29C45/00; B29C45/40; C08L69/00; C08L75/14
Foreign References:
| JP2018141083A | 2018-09-13 | |||
| JPH1036459A | 1998-02-10 | |||
| JPS6366597U | 1988-05-02 | |||
| JP2004351821A | 2004-12-16 | |||
| JP2009242673A | 2009-10-22 | |||
| JPH02155951A | 1990-06-15 | |||
| JP2010233853A | 2010-10-21 | |||
| JP2011032356A | 2011-02-17 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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