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Patent Searching and Data


Title:
RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/032606
Kind Code:
A1
Abstract:
Provided are: a resin composition from which a molded article having excellent slidability is obtained and which has excellent moldability; a molded article; and a method for producing a resin composition. This resin composition comprises, with respect to 100 parts by mass of (A) a polyacetal resin, 0.1-30.0 parts by mass of (B) an olefin polymer, 0.1-30.0 parts by mass of (C) a silicone oil having a kinematic viscosity of 1,000-55,000 cSt at 25°C, and 0.1-15.0 parts by mass of (D) a hydrocarbon wax, wherein (B)/(C), which is the mass ratio of the (B) olefin polymer to the (C) silicone oil, is at most 2.00.

Inventors:
ISHII TAKASHI (JP)
OHSHIMA MAKIKO (JP)
Application Number:
PCT/JP2022/030285
Publication Date:
March 09, 2023
Filing Date:
August 08, 2022
Export Citation:
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Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08L59/00; C08J3/215; C08L23/00; C08L83/04; C08L91/06
Foreign References:
JPH04224856A1992-08-14
JP2014055297A2014-03-27
JP2011178880A2011-09-15
JP2008019430A2008-01-31
Attorney, Agent or Firm:
SIKS & CO. (JP)
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