RESIN COMPOSITION AND MOLDED ARTICLE

Title:

RESIN COMPOSITION AND MOLDED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2012/005133

Kind Code:

A1

Abstract:

Provided is a resin composition capable of obtaining a molded article which is provided with both a low coefficient of kinetic friction and a high threshold PV value. The resin composition comprises an aromatic polyether ketone resin (I) and a fluororesin (II), and is characterized in that the fluororesin (II) is a copolymer of tetrafluoroethylene and a perfluoro ethylenically unsaturated compound represented by general formula (1) CF2=CF-Rf 1 (In the formula, Rf 1 represents -CF3 or -ORf 2. Rf 2 represents a C1-5 perfluoroalkyl group.), the mass ratio (I):(II) of the aromatic polyether ketone resin (I) and the fluororesin (II) is 95:5 to 50:50, the fluororesin (II) is dispersed in the form of particles in the aromatic polyether ketone resin (I), and the average dispersion particle diameter of the fluororesin (II) is 3.0 μm or less.

Inventors:

XIE XUMING (CN)
MASUDA HARUHISA (JP)

Application Number:

PCT/JP2011/064662

Publication Date:

January 12, 2012

Filing Date:

June 27, 2011

Export Citation:

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Assignee:

UNIV TSINGHUA (CN)
DAIKIN IND LTD (JP)
XIE XUMING (CN)
MASUDA HARUHISA (JP)

International Classes:

C08L71/10; C08L27/18

Domestic Patent References:

WO2003044093A1

2003-05-30

Foreign References:

JP2006274073A	2006-10-12
JPH06136255A	1994-05-17
JP2009052028A	2009-03-12
JP2009068390A	2009-04-02
JPH02212539A	1990-08-23
JPS58176242A	1983-10-15

Other References: