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Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2014/171461
Kind Code:
A1
Abstract:
A resin composition comprising 60 to 95 mass% of a polyphenylene ether (A), 35 to 0 mass% of a styrene resin (B) and 15 to 5 mass% of an elastomer component (C), wherein the component (C) exists in the form of dispersed particles in the resin composition and the dispersed particles have a number average particle diameter of 0.04 to 0.25 μm.

Inventors:
YAMAGUCHI TORU (JP)
Application Number:
PCT/JP2014/060744
Publication Date:
October 23, 2014
Filing Date:
April 15, 2014
Export Citation:
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Assignee:
ASAHI KASEI CHEMICALS CORP (JP)
International Classes:
C08L25/02; C08L71/12; C08L53/02; C08L91/00; F21S8/10; G02B5/08
Domestic Patent References:
WO2005030872A12005-04-07
WO2009125623A12009-10-15
WO2012070592A12012-05-31
WO2010134608A12010-11-25
Foreign References:
JP2012153832A2012-08-16
JP2013040288A2013-02-28
JPS61111354A1986-05-29
JP2007023078A2007-02-01
JP2013213132A2013-10-17
JP2009197196A2009-09-03
JPH0815149A1996-01-19
JPH01297428A1989-11-30
JPS63301222A1988-12-08
JP2013086736A2013-05-13
Other References:
See also references of EP 2987830A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
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