RESIN COMPOSITION AND RESIN MOLDED ARTICLE

Title:

RESIN COMPOSITION AND RESIN MOLDED ARTICLE

Document Type and Number:

WIPO Patent Application WO/2018/116497

Kind Code:

A1

Abstract:

Provided is a resin composition containing: a cellulose acetate in which the weight average degree of polymerization is 120-330 and the degree of substitution of an acetyl group is 2.10-2.60; a (meth)acrylic polymer having a weight average molecular weight of 1000-30000; and a plasticizer.

Inventors:

MORIYAMA MASAHIRO (JP)
YAO KENJI (JP)

Application Number:

PCT/JP2017/014866

Publication Date:

June 28, 2018

Filing Date:

April 11, 2017

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Assignee:

FUJI XEROX CO LTD (JP)

International Classes:

C08L1/12; C08K5/11; C08L33/06

Foreign References:

JP2015168708A	2015-09-28
JP2015168709A	2015-09-28
JP2016124883A	2016-07-11

Attorney, Agent or Firm:

KOH-EI PATENT FIRM, P.C. (JP)

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