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Title:
RESIN COMPOSITION AND RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/123496
Kind Code:
A1
Abstract:
Provided is a resin composition having high electrical conductivity without a high concentration of carbon fibers being blended therein. A resin composition obtained by molding a resin composition comprising a thermoplastic resin, carbon black, and carbon fibers coated with an electroconductive liquid, the resin composition characterized in that the content of the thermoplastic resin is 65% by mass to 94.9% by mass, the content of the carbon black is 5.0% by mass to 30% by mass, and the content of the carbon fibers coated with an electroconductive liquid is 0.1% by mass to 5.0% by mass.

Inventors:
YANE Akira (30-2 Shimomaruko 3-chome, Ohta-k, Tokyo 01, 〒1468501, JP)
Application Number:
JP2017/043923
Publication Date:
July 05, 2018
Filing Date:
December 07, 2017
Export Citation:
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Assignee:
CANON KABUSHIKI KAISHA (30-2, Shimomaruko 3-chome Ohta-k, Tokyo 01, 〒1468501, JP)
International Classes:
C08L101/00; B29C45/00; B29C70/88; C08J5/00; C08K3/04; C08K7/06; C08K9/04; G03G15/08
Domestic Patent References:
WO2014030556A12014-02-27
Foreign References:
JP2012167521A2012-09-06
JP2014139920A2014-07-31
JP2009272454A2009-11-19
JP2012229345A2012-11-22
JP2016510831A2016-04-11
JP2006128570A2006-05-18
JP2009035619A2009-02-19
JP2009155436A2009-07-16
JP2011506645A2011-03-03
JP2005220316A2005-08-18
JP2015186301A2015-10-22
JP2015003967A2015-01-08
JP2015018177A2015-01-29
Attorney, Agent or Firm:
OKABE Yuzuru et al. (Shin-Aoyama Bldg. East 8F, 1-1-1 Minamiaoyama Minato-k, Tokyo 62, 〒1070062, JP)
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