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Patent Searching and Data


Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/075405
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which has excellent molding stability and whereby it is possible to mold a molded article that has excellent dust generation resistance, heat resistance, dimensional stability, sliding ability, mechanical strength, and appearance; and a molded article obtained by molding the resin composition. The present invention relates to a resin composition containing a polyarylate resin, a polycarbonate resin, silica particles having an average particle diameter of 0.4-12 µm, fluorine-atom-containing polymer particles having an average particle diameter of 0.5-20 µm, and a specific phosphorous ester compound, the mass ratio of the polyarylate resin and the polycarbonate resin being 25/75-92/8, the content of the silica particles being 4-65 parts by mass with respect to a total of 100 parts by mass of the polyarylate resin and the polycarbonate resin, the content of the fluorine-atom-containing polymer particles being 0.5-12 parts by mass with respect to a total of 100 parts by mass of the polyarylate resin and the polycarbonate resin, and the content of the phosphorous ester compound being 0.008-1.2 parts by mass with respect to a total of 100 parts by mass of the polyarylate resin and the polycarbonate resin.

Inventors:
NABESHIMA YUTAKA (JP)
Application Number:
PCT/JP2020/038504
Publication Date:
April 22, 2021
Filing Date:
October 12, 2020
Export Citation:
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Assignee:
UNITIKA LTD (JP)
International Classes:
C08K5/526; C08K3/04; C08K3/36; C08L27/12; C08L67/03; C08L69/00
Domestic Patent References:
WO2017204078A12017-11-30
WO2017204078A12017-11-30
Foreign References:
JP2016108526A2016-06-20
JP2007196516A2007-08-09
JP2006291081A2006-10-26
JP2009062461A2009-03-26
JP2010155929A2010-07-15
JPH1087982A1998-04-07
JP2008050488A2008-03-06
Other References:
See also references of EP 4047046A4
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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