Title:
RESIN COMPOSITION, MOLDED BODY, AND ELECTROMAGNETIC WAVE ABSORBER
Document Type and Number:
WIPO Patent Application WO/2022/181697
Kind Code:
A1
Abstract:
Provided are a resin composition that has a high electromagnetic wave absorption rate, a molded body, and an electromagnetic wave absorber. The resin composition contains a thermoplastic resin and a conductive substance, and when the resin composition is cut into a test piece having a thickness of 2mm and the cross-section thereof is observed with a digital microscope, the area ratio of aggregates derived from the conductive substance and having a circle equivalent diameter of at least 30 μm is at most 0.80%.
Inventors:
ISEKI SHUTA (JP)
SHOJI HIDEKAZU (JP)
KITAGAWA SATOMI (JP)
SHOJI HIDEKAZU (JP)
KITAGAWA SATOMI (JP)
Application Number:
PCT/JP2022/007629
Publication Date:
September 01, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08J3/22; C08J5/18; C08K3/01; C08K3/04; C08K7/06; C08L25/04; C08L67/02; C08L101/00; H01B1/24; H01B5/16; H05K9/00
Domestic Patent References:
| WO2019167854A1 | 2019-09-06 | |||
| WO2017038949A1 | 2017-03-09 |
Foreign References:
| JP2003100147A | 2003-04-04 | |||
| JP2018021117A | 2018-02-08 | |||
| JP2009197056A | 2009-09-03 | |||
| JP2005162814A | 2005-06-23 | |||
| JP2019197048A | 2019-11-14 | |||
| JP2010155993A | 2010-07-15 | |||
| JP2010174223A | 2010-08-12 | |||
| JP2005344065A | 2005-12-15 | |||
| JP2011132550A | 2011-07-07 | |||
| JP2018070722A | 2018-05-10 | |||
| JP2019056035A | 2019-04-11 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF: