Title:
RESIN COMPOSITION, MOLDED BODY AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/085325
Kind Code:
A1
Abstract:
A resin composition according to the present invention contains a polyimide and an acrylic resin. The polyimide contains, as a tetracarboxylic acid dianhydride component, a fluorine-containing aromatic tetracarboxylic acid dianhydride and a fluorine-free aromatic tetracarboxylic acid dianhydride, while containing a fluoroalkyl-substituted benzidine as a diamine component. Relative to the total content of the tetracarboxylic acid dianhydride component in the polyimide, the content of the fluorine-containing aromatic tetracarboxylic acid dianhydride is preferably 30% by mole to 90% by mole, and the content of the fluorine-free aromatic tetracarboxylic acid dianhydride is preferably 10% by mole to 70% by mole. Relative to the total content of the diamine component in the polyimide, the content of the fluoroalkyl-substituted benzidine is preferably 25% by mole or more.
Inventors:
OGAWA KOHEI (JP)
ISHIGURO FUMIYASU (JP)
KOMA HIROTO (JP)
USHIRO HIROYUKI (JP)
ISHIGURO FUMIYASU (JP)
KOMA HIROTO (JP)
USHIRO HIROYUKI (JP)
Application Number:
PCT/JP2022/041732
Publication Date:
May 19, 2023
Filing Date:
November 09, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L79/08; C08G73/10; C08J5/18; C08L33/12
Domestic Patent References:
| WO2012018121A1 | 2012-02-09 | |||
| WO2012002134A1 | 2012-01-05 |
Foreign References:
| JP2021101002A | 2021-07-08 | |||
| JP2016204569A | 2016-12-08 | |||
| JP2021152157A | 2021-09-30 | |||
| JP2018529987A | 2018-10-11 | |||
| CN109666251A | 2019-04-23 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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