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Patent Searching and Data


Title:
RESIN COMPOSITION AND MOLDED BODY THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/054820
Kind Code:
A1
Abstract:
The present invention provides: a resin composition that has excellent flexibility and exhibits excellent durability at the time of thermal molding; and a molded body. The present invention pertains to a resin composition that includes: a copolymer (B) formed from a vinyl alcohol-based polymer (B-1) domain and a diene-based polymer (B-2) domain; and at least one compound selected from the group consisting of a phenol-based compound (C), an amine-based compound (D), and a phosphorus-based compound (E).

Inventors:
AMANO YUSUKE (JP)
ISHIDA EIICHI (JP)
YAMANAKA MASAYOSHI (JP)
MAEKAWA KAZUHIKO (JP)
Application Number:
PCT/JP2019/035969
Publication Date:
March 19, 2020
Filing Date:
September 12, 2019
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C08F255/02; C08L51/06; C08K5/13; C08K5/17; C08K5/524
Domestic Patent References:
WO2015190029A12015-12-17
WO2019004455A12019-01-03
WO2015190029A12015-12-17
Foreign References:
JPH0321611A1991-01-30
JPH0321613A1991-01-30
JPS4516460B11970-06-08
JPS4517439B11970-06-16
JP2005534783A2005-11-17
JPS396386B1
JPS4121994B11966-12-22
JPS3906386B
JPS4121994B11966-12-22
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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