Title:
RESIN COMPOSITION, MOLDED BODY, AND THERMALLY EXPANDABLE MICROSPHERE
Document Type and Number:
WIPO Patent Application WO/2019/124233
Kind Code:
A1
Abstract:
Provided are: a resin composition capable of forming a molded body in which the generation of splinters on the surface thereof can be suppressed; a molded body obtained by molding the resin composition; and a thermally expandable microsphere suitable for use in the resin composition. This resin composition contains: a thermally expandable microsphere composed of a shell made of a thermoplastic resin and a foaming agent contained inside the shell and vaporized by heating; and at least one base resin selected from among a rubber, an olefin-based resin, and a thermoplastic elastomer, wherein the thermoplastic resin is a polymer of a polymerizable component containing an N-substituted maleimide and a nitrile-based monomer containing methacrylonitrile as an essential component.
Inventors:
EBE TAKUMI (JP)
MIKI KATSUSHI (JP)
MIKI KATSUSHI (JP)
Application Number:
PCT/JP2018/046015
Publication Date:
June 27, 2019
Filing Date:
December 14, 2018
Export Citation:
Assignee:
MATSUMOTO YUSHI SEIYAKU KK (JP)
International Classes:
B29C44/00; C08J9/32; C08J3/22; C08K9/10; C08L23/00
Domestic Patent References:
| WO1999046320A1 | 1999-09-16 | |||
| WO2009050863A1 | 2009-04-23 | |||
| WO2007058379A1 | 2007-05-24 | |||
| WO2008142849A1 | 2008-11-27 |
Foreign References:
| JP2016050295A | 2016-04-11 | |||
| JPH04178442A | 1992-06-25 | |||
| JP2008255294A | 2008-10-23 | |||
| CN101550215A | 2009-10-07 |
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