Title:
RESIN COMPOSITION, MOLDED BODY USING SAID RESIN COMPOSITION, AND FILM STRUCTURE, BUILDING STRUCTURE AND ADHESIVE MOLDED BODY EACH USING SAID RESIN COMPOSITION OR SAID MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2020/203528
Kind Code:
A1
Abstract:
A resin composition which contains (A) an ethylene-chlorotrifluoroethylene copolymer and (B) a phosphite antioxidant that does not have a phenolic hydroxyl group in each molecule; a molded body which uses this resin composition; and a film structure, a building structure and an adhesive molded body, each of which uses the resin composition or the molded body.
Inventors:
YASUMOTO NORIAKI (JP)
NAKANO SHUNSUKE (JP)
OISHI MASAYUKI (JP)
NAKANO SHUNSUKE (JP)
OISHI MASAYUKI (JP)
Application Number:
PCT/JP2020/013252
Publication Date:
October 08, 2020
Filing Date:
March 25, 2020
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08K5/134; C08K5/524; C08L23/06; C08L27/12
Domestic Patent References:
| WO2018066584A1 | 2018-04-12 | |||
| WO2017033701A1 | 2017-03-02 |
Foreign References:
| JP2016518512A | 2016-06-23 | |||
| JP2001270969A | 2001-10-02 | |||
| JP2013543027W | ||||
| JPH1077318A | 1998-03-24 | |||
| JPS60188447A | 1985-09-25 | |||
| US5051460A | 1991-09-24 | |||
| US4775709A | 1988-10-04 | |||
| US4539354A | 1985-09-03 | |||
| JP2019067611A | 2019-04-25 |
Other References:
See also references of EP 3950806A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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