RESIN COMPOSITION AND MOLDED BODY

WIPO Patent Application WO/2016/132597

A1

Provided is a resin composition characterized by containing a resin, a light-emitting substance, and a radiopaque substance, wherein the content of the radiopaque substance is 2 mass% to 80 mass%. Also provided is any of the abovementioned resin compositions wherein the content of the light-emitting substance is 0.001 mass% to 0.5 mass%. Also provided is any of the abovementioned resin compositions wherein the light-emitting substance is a near-infrared fluorescent material or a phosphorescent material. Also provided is any of the abovementioned resin compositions wherein the radiopaque substance is barium sulfate, bismuth oxide, bismuth subcarbonate, calcium carbonate, aluminum hydroxide, tungsten, zinc oxide, zirconium oxide, zirconium, titanium, platinum, bismuth subnitrate, or bismuth. Also provided is a molded body obtained by processing any of the abovementioned resin compositions.

SAKURAI NAOTO (JP)
SAKURAI YOSHINOBU (JP)
WATANABE YASUYUKI (JP)
IKEDA TAKEO (JP)
SATO TAKAYUKI (JP)

PCT/JP2015/079337

August 25, 2016

October 16, 2015

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DAINIPPON INK & CHEMICALS (JP)
NAT UNIV CORP KOCHI UNIV (JP)

C08L101/00; A61L29/00; A61L31/00; C08K3/00; C08K5/55; C09B57/10; C09B67/20; C09B67/44; C09K11/06

WO2015022977A1	2015-02-19
WO2012073774A1	2012-06-07
WO2007126052A1	2007-11-08
WO2015056779A1	2015-04-23

JP2008031190A	2008-02-14
JPS63281660A	1988-11-18
JP2008541987A	2008-11-27
JP2013060399A	2013-04-04
JP2011162445A	2011-08-25
JP2009263614A	2009-11-12
JP2010090313A	2010-04-22

TANAI Sumio et al. (JP)
Sumio Tanai (JP)

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