Title:
RESIN COMPOSITION AND RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/061251
Kind Code:
A1
Abstract:
Provided is a resin composition containing a thermoplastic resin, a carbon fiber, a polyamide, and a compatibilizer, wherein the polyamide has: a structural unit in which a dicarboxylic acid and a diamine are condensation-polymerized, or a structural unit which has a ring-opened lactam and contains an aromatic ring other than an aramid structural unit; and a structural unit not containing an aromatic ring.
Inventors:
MIYAMOTO TSUYOSHI (JP)
OKOSHI MASAYUKI (JP)
MORIYA HIROYUKI (JP)
OKOSHI MASAYUKI (JP)
MORIYA HIROYUKI (JP)
Application Number:
PCT/JP2017/010761
Publication Date:
April 05, 2018
Filing Date:
March 16, 2017
Export Citation:
Assignee:
FUJI XEROX CO LTD (JP)
International Classes:
C08L101/00; C08K7/06; C08L23/26; C08L77/00
Foreign References:
| JP2010168526A | 2010-08-05 | |||
| JPH0258552A | 1990-02-27 | |||
| JP2001503799A | 2001-03-21 |
Other References:
See also references of EP 3480259A4
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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