Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION AND RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/061264
Kind Code:
A1
Abstract:
This resin composition includes: a polyolefin; carbon fibers having an average fiber length of 0.1 to 2.5 mm; a resin including at least one among an amide bond and an imide bond, the content of the resin with respect to 100 parts by mass of the polyolefin being greater than 20 parts by mass and less than or equal to 100 parts by mass; and a compatibilizer.

Inventors:
IWADATE YUKO (JP)
OKOSHI MASAYUKI (JP)
MORIYA HIROYUKI (JP)
MIYAMOTO TSUYOSHI (JP)
NAKAYAMA DAISUKE (JP)
Application Number:
PCT/JP2017/012454
Publication Date:
April 05, 2018
Filing Date:
March 27, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJI XEROX CO LTD (JP)
International Classes:
C08L23/00; C08J5/04; C08K7/06; C08L23/26; C08L77/00
Domestic Patent References:
WO2016076411A12016-05-19
Foreign References:
JPH0258552A1990-02-27
JPH0649295A1994-02-22
JPH06179815A1994-06-28
JP2003528956A2003-09-30
JP2014181307A2014-09-29
JP2016190264A2016-11-10
Other References:
POLYM. ENG. SCI., vol. 14, 1974, pages 147
See also references of EP 3495419A4
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
Download PDF: