Title:
RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/190631
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which has process heat resistance that is adaptable to the cases where the resin composition is melted and mixed, as a phase transition material, with a resin at a relatively high temperature, and which contains a heat storage compound having characteristics that prevent leakage of the heat storage compound from a resin if formed into a molded body, while enabling the achievement of a molded body that is able to be temperature sensitively controlled, and has excellent embrittlement resistance and excellent lightweight properties; and a molded body which is formed of this resin composition. A resin composition which contains 100 parts by mass of a thermoplastic resin (A) that has a density, an MFR and a type A durometer hardness in specific ranges, 10 to 100 parts by mass of a heat storage compound (B) that has a flash point of 200°C or higher, and 1.5 to 20 parts by mass of a porous inorganic compound (C) that has an oil absorption of 4.0 g/g or more, wherein the content of the heat storage compound (B) is less than 700 parts by mass if the content of the porous inorganic compound (C) is taken as 100 parts by mass.
Inventors:
YOSHII HIROAKI (JP)
Application Number:
PCT/JP2022/001332
Publication Date:
September 15, 2022
Filing Date:
January 17, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08K5/101; C08K7/24; C08L101/00
Domestic Patent References:
| WO2019077989A1 | 2019-04-25 | |||
| WO2011078340A1 | 2011-06-30 | |||
| WO2018021467A1 | 2018-02-01 |
Foreign References:
| JPH0226884A | 1990-01-29 | |||
| JPH0236235A | 1990-02-06 | |||
| JP2016196601A | 2016-11-24 | |||
| JPH0559352A | 1993-03-09 | |||
| JP2014122320A | 2014-07-03 | |||
| JP2000063578A | 2000-02-29 | |||
| JPH02258852A | 1990-10-19 | |||
| JP2019116570A | 2019-07-18 | |||
| JP2019218518A | 2019-12-26 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Download PDF: