Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION AND RESIN MOLDED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/129270
Kind Code:
A1
Abstract:
A resin composition imparted with a sufficient heat conducting function is provided. This resin composition (10) contains a thermoplastic resin (3), carbon fibers (1) and an insulating, thermally conductive filler (2). The insulating thermally conductive filler (2) is distributed in a mesh pattern in the thermoplastic resin (3).

More Like This:
JP6321000Fluoropolymer composition
JP2007196516MANUFACTURING METHOD OF POLYARYLATE RESIN COMPOSITION
JP2853464SILICONE RUBBER COMPOSITION HAVING OIL BLEEDING PROPERTY, ITS PRODUCTION AND ITS CURED MATERIAL
Inventors:
NISHIKAWA KAZUYOSHI (JP)
Application Number:
PCT/JP2019/009528
Publication Date:
June 25, 2020
Filing Date:
March 08, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
C08J3/20; C08J5/04
Foreign References:
JP2015183100A2015-10-22
JP2016190922A2016-11-10
JP2011216437A2011-10-27
JPH09234734A1997-09-09
JPS5846508A1983-03-18
JP2008166641A2008-07-17
Attorney, Agent or Firm:
MURAKAMI, Takashi (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: RESIN COMPOSITION AND RESIN MOLDED ARTICLE

Next Patent: CASTING DEVICE