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Title:
RESIN COMPOSITION AND MOLDED RESIN OBJECT
Document Type and Number:
WIPO Patent Application WO/2018/030105
Kind Code:
A1
Abstract:
The present invention relates to: a resin composition which comprises a nucleator and a hydrogenated crystalline ring-opening polymerization polymer of dicyclopentadiene, characterized in that the content of the nucleator is 0.01-0.50 parts by weight per 100 parts by weight of the hydrogenated crystalline ring-opening polymerization polymer of dicyclopentadiene; and a molded resin object which comprises a nucleator and a hydrogenated crystalline ring-opening polymerization polymer of dicyclopentadiene, characterized in that the content of the nucleator is 0.01-0.50 parts by weight per 100 parts by weight of the hydrogenated crystalline ring-opening polymerization polymer of dicyclopentadiene. The present invention provides: a resin composition which contains a hydrogenated crystalline ring-opening polymerization polymer of dicyclopentadiene and is suitable for use as a raw material for less contaminative molded resin objects; and a molded resin object which contains a hydrogenated crystalline ring-opening polymerization polymer of dicyclopentadiene and is less contaminative.

Inventors:
MIYAZAWA SHINSUKE (JP)
KATO AYAKO (JP)
Application Number:
PCT/JP2017/026268
Publication Date:
February 15, 2018
Filing Date:
July 20, 2017
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
C08K3/00; C08L65/00; C08K5/00; C08K5/521
Domestic Patent References:
WO2012033076A12012-03-15
Foreign References:
JP2015054885A2015-03-23
JP2013010309A2013-01-17
JP2009084332A2009-04-23
JPS6049012A1985-03-18
Other References:
See also references of EP 3498775A4
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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