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Patent Searching and Data


Title:
RESIN COMPOSITION AND MOLDED RESIN OBJECT
Document Type and Number:
WIPO Patent Application WO/2018/073993
Kind Code:
A1
Abstract:
A resin composition which comprises a thermoplastic resin, carbon fibers, glass fibers, a resin containing amide bonds and/or imide bonds, and a compatibilizing agent.

Inventors:
OKOSHI MASAYUKI (JP)
MORIYA HIROYUKI (JP)
MIYAMOTO TSUYOSHI (JP)
Application Number:
PCT/JP2017/013996
Publication Date:
April 26, 2018
Filing Date:
April 03, 2017
Export Citation:
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Assignee:
FUJI XEROX CO LTD (JP)
International Classes:
C08J5/04; C08L101/00; C08K7/06; C08K7/14; C08L23/00; C08L77/00
Foreign References:
JP2009532574A2009-09-10
JP2003528956A2003-09-30
JP2016138163A2016-08-04
JPS5767658A1982-04-24
JP2013166922A2013-08-29
JP2008179753A2008-08-07
JP2010155993A2010-07-15
JP2016074779A2016-05-12
JPH04153257A1992-05-26
JP2003528956A2003-09-30
JP2014181307A2014-09-29
JP2000071245A2000-03-07
JP2016206983A2016-12-08
JP2014234503A2014-12-15
JP2008150485A2008-07-03
Other References:
POLYM. ENG. SCI., vol. 14, 1974, pages 147
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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