Title:
RESIN COMPOSITION AND MOLDED RESIN OBJECT
Document Type and Number:
WIPO Patent Application WO/2018/073993
Kind Code:
A1
Abstract:
A resin composition which comprises a thermoplastic resin, carbon fibers, glass fibers, a resin containing amide bonds and/or imide bonds, and a compatibilizing agent.
Inventors:
OKOSHI MASAYUKI (JP)
MORIYA HIROYUKI (JP)
MIYAMOTO TSUYOSHI (JP)
MORIYA HIROYUKI (JP)
MIYAMOTO TSUYOSHI (JP)
Application Number:
PCT/JP2017/013996
Publication Date:
April 26, 2018
Filing Date:
April 03, 2017
Export Citation:
Assignee:
FUJI XEROX CO LTD (JP)
International Classes:
C08J5/04; C08L101/00; C08K7/06; C08K7/14; C08L23/00; C08L77/00
Foreign References:
JP2009532574A | 2009-09-10 | |||
JP2003528956A | 2003-09-30 | |||
JP2016138163A | 2016-08-04 | |||
JPS5767658A | 1982-04-24 | |||
JP2013166922A | 2013-08-29 | |||
JP2008179753A | 2008-08-07 | |||
JP2010155993A | 2010-07-15 | |||
JP2016074779A | 2016-05-12 | |||
JPH04153257A | 1992-05-26 | |||
JP2003528956A | 2003-09-30 | |||
JP2014181307A | 2014-09-29 | |||
JP2000071245A | 2000-03-07 | |||
JP2016206983A | 2016-12-08 | |||
JP2014234503A | 2014-12-15 | |||
JP2008150485A | 2008-07-03 |
Other References:
POLYM. ENG. SCI., vol. 14, 1974, pages 147
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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