Title:
RESIN COMPOSITION AND MOLDED RESIN OBJECT
Document Type and Number:
WIPO Patent Application WO/2019/064624
Kind Code:
A1
Abstract:
A resin composition is provided from which a molded resin object excellent in terms of tensile rupture strain is obtained. The resin composition comprises: a cellulose ester compound (A); a poly(meth)acrylate-based compound (B) comprising 50 mass% or more constituent units derived from an alkyl (meth)acrylate; a polyester resin (C); and at least one polymer (D) selected from between a polymer of a core-shell structure comprising a core layer and, disposed on the surface of the core layer, a shell layer comprising an alkyl (meth)acrylate polymer and an olefin-based polymer which is an α-olefin/alkyl (meth)acrylate polymer and comprises 60 mass% or more constituent units derived from the α-olefin.
More Like This:
Inventors:
TANAKA RYO (JP)
MIYAZAKI KANA (JP)
MORIYAMA MASAHIRO (JP)
YAO KENJI (JP)
MIYAZAKI KANA (JP)
MORIYAMA MASAHIRO (JP)
YAO KENJI (JP)
Application Number:
PCT/JP2018/005133
Publication Date:
April 04, 2019
Filing Date:
February 14, 2018
Export Citation:
Assignee:
FUJI XEROX CO LTD (JP)
International Classes:
C08L1/08; C08L23/00; C08L33/06; C08L51/04; C08L67/00
Domestic Patent References:
WO2007088736A1 | 2007-08-09 | |||
WO2015076250A1 | 2015-05-28 | |||
WO2011055590A1 | 2011-05-12 | |||
WO2004087812A1 | 2004-10-14 |
Foreign References:
JP2004204217A | 2004-07-22 | |||
JP2006328368A | 2006-12-07 | |||
JP2008133445A | 2008-06-12 | |||
JP2010037485A | 2010-02-18 | |||
JPH06504558A | 1994-05-26 | |||
JP5298496B2 | 2013-09-25 | |||
JP2010037485A | 2010-02-18 | |||
JP2017184698A | 2017-10-12 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
Download PDF:
Previous Patent: ELECTROSPINNING DEVICE, CLEANING DEVICE, AND ELECTROSPINNING METHOD
Next Patent: ELECTROSPINNING DEVICE
Next Patent: ELECTROSPINNING DEVICE