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Patent Searching and Data


Title:
RESIN COMPOSITION AND MOLDED RESIN OBJECT
Document Type and Number:
WIPO Patent Application WO/2019/064624
Kind Code:
A1
Abstract:
A resin composition is provided from which a molded resin object excellent in terms of tensile rupture strain is obtained. The resin composition comprises: a cellulose ester compound (A); a poly(meth)acrylate-based compound (B) comprising 50 mass% or more constituent units derived from an alkyl (meth)acrylate; a polyester resin (C); and at least one polymer (D) selected from between a polymer of a core-shell structure comprising a core layer and, disposed on the surface of the core layer, a shell layer comprising an alkyl (meth)acrylate polymer and an olefin-based polymer which is an α-olefin/alkyl (meth)acrylate polymer and comprises 60 mass% or more constituent units derived from the α-olefin.

Inventors:
TANAKA RYO (JP)
MIYAZAKI KANA (JP)
MORIYAMA MASAHIRO (JP)
YAO KENJI (JP)
Application Number:
PCT/JP2018/005133
Publication Date:
April 04, 2019
Filing Date:
February 14, 2018
Export Citation:
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Assignee:
FUJI XEROX CO LTD (JP)
International Classes:
C08L1/08; C08L23/00; C08L33/06; C08L51/04; C08L67/00
Domestic Patent References:
WO2007088736A12007-08-09
WO2015076250A12015-05-28
WO2011055590A12011-05-12
WO2004087812A12004-10-14
Foreign References:
JP2004204217A2004-07-22
JP2006328368A2006-12-07
JP2008133445A2008-06-12
JP2010037485A2010-02-18
JPH06504558A1994-05-26
JP5298496B22013-09-25
JP2010037485A2010-02-18
JP2017184698A2017-10-12
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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