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Title:
RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/123807
Kind Code:
A1
Abstract:
A resin composition for molding which comprises a curable resin and an inorganic filler comprising calcium titanate particles.

Inventors:
NAKAYAMA AYUMI (JP)
KONDO YUSUKE (JP)
YAMAURA MASASHI (JP)
NOGUCHI YUJI (JP)
ARATA MICHITOSHI (JP)
HIRAI TOMOKI (JP)
Application Number:
PCT/JP2021/017047
Publication Date:
June 16, 2022
Filing Date:
April 28, 2021
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L101/00; C08K3/24; C08L63/00
Foreign References:
JPH079609A1995-01-13
JPH10158472A1998-06-16
JP2001192536A2001-07-17
JP2003147171A2003-05-21
JP2017037287A2017-02-16
JP2012246367A2012-12-13
JP2014098103A2014-05-29
US20180025999A12018-01-25
JP2018093491A2018-06-14
JP6870778B12021-05-12
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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