Title:
RESIN COMPOSITION FOR MOLDING, MANUFACTURING METHOD FOR SEALING STRUCTURE, AND SEALING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/189996
Kind Code:
A1
Abstract:
This resin composition for molding is for collectively sealing: a substrate equipped with an electronic component; a stator core which is fixed onto the substrate and which has a plurality of slots formed in the circumferential direction; and a plurality of coils accommodated in the slots. The resin composition comprises: an epoxy resin; a curing agent and/or a curing catalyst; and an inorganic filler. A cured product yielded by curing the resin composition for molding at 140°C for two minutes has a bending elastic modulus (according to JIS K6911:2006) at 25°C of 0.1 GPa to 30 GPa.
Inventors:
DAKEDE KAZUHIKO (JP)
Application Number:
PCT/JP2023/011406
Publication Date:
October 05, 2023
Filing Date:
March 23, 2023
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H01L23/29; C08K3/013; C08L63/00; H01L21/56
Foreign References:
| JP2010110198A | 2010-05-13 | |||
| JP2021015932A | 2021-02-12 | |||
| JP2015000941A | 2015-01-05 | |||
| JP2017206631A | 2017-11-24 | |||
| JP2001196400A | 2001-07-19 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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