RESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED OBJECT

Title:

RESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED OBJECT

Document Type and Number:

WIPO Patent Application WO/2001/058978

Kind Code:

A1

Abstract:

A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfaalkylated so as to have improved hydrophilicity.

Inventors:

HORIKI SEINOSUKE (JP)
OGAWA MASANORI (JP)
KAJITA TAKEHIKO (JP)
ITOU KUNINORI (JP)

Application Number:

PCT/JP2001/000809

Publication Date:

August 16, 2001

Filing Date:

February 05, 2001

Export Citation:

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Assignee:

NAGOYA OILCHEMICAL (JP)
HORIKI SEINOSUKE (JP)
OGAWA MASANORI (JP)
KAJITA TAKEHIKO (JP)
ITO KUNINORI (JP)

International Classes:

C08G8/28; C08G14/12; C08J3/24; C08L61/06; C08L61/14; C08L63/00; (IPC1-7): C08G59/62; C08L63/00; C08J5/24; C08G8/28; C08G14/12

Foreign References:

JPH09206885A	1997-08-12
JPH0710946A	1995-01-13
JPH11343455A	1999-12-14

Other References: