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Patent Searching and Data


Title:
RESIN COMPOSITION FOR MOLDING MATERIAL AND MOLDED ARTICLE MADE THEREFROM
Document Type and Number:
WIPO Patent Application WO/2005/012425
Kind Code:
A1
Abstract:
A resin composition for molding materials which comprises: an acrylic polymer comprising primary particles which have a core/shell structure comprising a core polymer and a shell polymer and in which the core polymer and shell polymer comprise methyl methacrylate monomer units and the content of methyl methacrylate monomer units in the core polymer is lower than that of methyl methacrylate monomer units in the shell polymer; and a plasticizer. The resin composition has high moldability during molding and gives a molded article having high hardness and high tear strength and reduced in plasticizer bleeding.

Inventors:
KASAI TOSHIHIRO (JP)
SEKITA MARI (JP)
ITO MASAKAZU (JP)
Application Number:
PCT/JP2004/010919
Publication Date:
February 10, 2005
Filing Date:
July 30, 2004
Export Citation:
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Assignee:
MITSUBISHI RAYON CO (JP)
KASAI TOSHIHIRO (JP)
SEKITA MARI (JP)
ITO MASAKAZU (JP)
International Classes:
C08F265/04; C08F265/06; C08L33/12; C08L51/00; C09D151/00; C08L67/00; C08L71/02; (IPC1-7): C08L33/12
Domestic Patent References:
WO2000001748A12000-01-13
Foreign References:
JPH07233299A1995-09-05
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