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Patent Searching and Data


Title:
RESIN COMPOSITION, AND MOLDING MATERIAL AND MULTILAYER STRUCTURE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2018/164146
Kind Code:
A1
Abstract:
The present invention provides a resin composition which includes a saponified ethylene-vinyl ester-based copolymer (A), a layered inorganic compound (B), and a carbonate (C) (where the carbonate (C) does not include the layered inorganic compound (B)), the resin composition having a high level of processability.

Inventors:
YAMAMOTO NOBUYUKI (JP)
ONO AKIRA (JP)
MAKI FUMIMASA (JP)
Application Number:
PCT/JP2018/008641
Publication Date:
September 13, 2018
Filing Date:
March 06, 2018
Export Citation:
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Assignee:
NIPPON SYNTHETIC CHEM IND CO LTD (JP)
International Classes:
C08L29/04; B32B27/30; C08K3/00; C08K5/109
Foreign References:
JPS5073942A1975-06-18
JP2004034616A2004-02-05
JP2004136281A2004-05-13
JPH07285528A1995-10-31
JPH1149901A1999-02-23
JPH0372541A1991-03-27
JP2002137339A2002-05-14
JP2004224845A2004-08-12
JP2000026689A2000-01-25
JP2000290457A2000-10-17
JP2017041437A2017-02-23
Other References:
See also references of EP 3594286A4
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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