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Patent Searching and Data


Title:
RESIN COMPOSITION FOR MULTILAYER ELECTRONIC COMPONENTS, DRY FILM, CURED PRODUCT, MULTILAYER ELECTRONIC COMPONENT, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/163292
Kind Code:
A1
Abstract:
Provided are: a resin composition for multilayer electronic components, which is suitable for the production of a small multilayer electronic component that exhibits excellent distinguishability in appearance inspection; a dry film which has a resin layer that is obtained from the composition; a cured product of the composition or the resin layer of the dry film; a multilayer electronic component which is provided with a protective layer that contains the cured product; and a printed wiring board which comprises the multilayer electronic component. A resin composition for multilayer electronic components, which is used for protective layers of a multilayer electronic component that is obtained by alternately stacking electrode layers and insulating layers and by providing protective layers on both end faces in the stacking direction, and which is characterized by containing a curable resin, an inorganic filler and a coloring agent.

Inventors:
OKITSU SATOSHI (JP)
CHUJO TAKAYUKI (JP)
AOYAMA YOSHITOMO (JP)
ENDO ARATA (JP)
GUAN ZHONG (JP)
Application Number:
JP2018/048327
Publication Date:
August 29, 2019
Filing Date:
December 27, 2018
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (Postcode3550215, JP)
International Classes:
C08L101/00; C08K3/22; C08K3/36; H01F17/00; H01G2/24; H01G4/224; H01G4/30
Foreign References:
JP2014027261A2014-02-06
US20150287516A12015-10-08
JP2008235762A2008-10-02
JP2017216409A2017-12-07
JP2018184582A2018-11-22
Attorney, Agent or Firm:
HONDA Ichiro (Postcode1050001, JP)
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