Title:
RESIN COMPOSITION AND MULTILAYER LAMINATED FILM
Document Type and Number:
WIPO Patent Application WO/2023/204306
Kind Code:
A1
Abstract:
The present invention provides: a resin composition with which a plurality of resin layers made of different resins can be bonded to each other more strongly than with conventional resin compositions; and a multilayer laminated film in which resin layers made of different resins are bonded to each other more strongly than in the prior art. This resin composition is characterized by containing: [I] a modified ethylene·α-olefin copolymer [A] which is obtained by modifying a copolymer of ethylene and an α-olefin having 3-20 carbon atoms with an unsaturated carboxylic acid or a derivative thereof and which satisfies (i) the density falls within the range of not less than 0.860 g/cm3 and less than 0.900 g/cm3 and (ii) the graft amount is 0.01-5 mass%; [II] an unmodified ethylene·α-olefin copolymer [B] having a melting point of 121°C or lower; and [III] an unmodified ethylene·α-olefin copolymer elastomer [C]. The resin composition is also characterized in that the melt flow rate (ASTM D 1238, 190ºC, 2.16 kg load) falls within the range 0.1-50 g/10 min, and the graft amount of the unsaturated carboxylic acid or derivative thereof falls within the range 0.01-1.0 mass% relative to a total of 100 mass% of the resin composition.
Inventors:
HAYAKAWA AKIO (JP)
Application Number:
PCT/JP2023/015919
Publication Date:
October 26, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L23/26; B32B27/32; C08L23/08
Foreign References:
| JPH09249779A | 1997-09-22 | |||
| JP2012172047A | 2012-09-10 | |||
| JPS61132345A | 1986-06-19 | |||
| JP2021098790A | 2021-07-01 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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