Title:
RESIN COMPOSITION AND MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/057561
Kind Code:
A1
Abstract:
Provided is a resin composition whereby the bend characteristics and cutting processability of a B-stage film can be increased, the dielectric loss tangent of a cured material can be reduced, and the thermal dimensional stability of a cured material can be increased. The resin composition pertaining to the present invention includes an epoxy compound, a curing agent, and an inorganic filler, the epoxy compound including 1 wt% to 10 wt% of a liquid epoxy compound having a viscosity at 25°C of 500 mPa∙s or less, with respect to a total of 100 wt% of the epoxy compound.
Inventors:
BABA SUSUMU (JP)
HAYASHI TATSUSHI (JP)
KOUYANAGI HIROSHI (JP)
HAYASHI TATSUSHI (JP)
KOUYANAGI HIROSHI (JP)
Application Number:
PCT/JP2016/078800
Publication Date:
April 06, 2017
Filing Date:
September 29, 2016
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08G59/40; C08K3/00; H01B3/40; H05K1/03
Domestic Patent References:
| WO2008010555A1 | 2008-01-24 |
Foreign References:
| JP2001139772A | 2001-05-22 | |||
| JP2010202727A | 2010-09-16 | |||
| JP2014177530A | 2014-09-25 | |||
| JP2010062297A | 2010-03-18 | |||
| JP2014013825A | 2014-01-23 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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