RESIN COMPOSITION AND MULTILAYERED STRUCTURE USING THE SAME

WIPO Patent Application WO/2010/071241

A2

Provided is a resin composition comprising (A) polyolefin, (B) ethylene-vinyl acetate copolymer saponification product having an ethylene content of 20 to 65 mol% and a vinyl acetate unit degree of saponification of 96% or greater, (C) a C8-22 higher fatty acid metal salt, and (D) a conjugated polyene compound having a boiling point of 20°C or higher. The mass ratio (A:B) of the polyolefin (A) and ethylene-vinyl acetate copolymer saponification product (B) is 60:40 to 99.9:0.1. The resin composition contains the higher fatty acid metal salt (C) within a range of 0.0001 to 10 parts by mass per total 100 parts by mass of polyolefin (A) + ethylene-vinyl acetate copolymer saponification product (B), and contains the conjugated polyene compound (D) within a range of 0.000001 to 1 part by mass per total 100 parts by mass of polyolefin (A) + ethylene-vinyl acetate copolymer saponification product (B). Thus, production of aggregate within a microregion is suppressed and EVOH dispersibility is improved. Moreover, appearance defects caused by the formation of a wave-like pattern on the molded product surface due to aggregate-associated fluidity anomalies, and the like, are suppressed and a molded product having a pleasing appearance is obtained.

KAZETO OSAMU (JP)

PCT/JP2010/054029

June 24, 2010

March 10, 2010

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KURARAY CO (JP)
KAZETO OSAMU (JP)

C08L23/00; B32B27/28; B32B27/32; C08K3/26; C08K5/01; C08K5/098; C08L23/26; C08L29/04

JPH101570A	1998-01-06
JPH0971620A	1997-03-18
JPH0372542A	1991-03-27
JPS5339380A	1978-04-11

None
See also references of EP 2407508A4

NAKATSUKASA, SHIGEKI (JP)
Shigeki Nakamu (JP)

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