Title:
RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPERATURE PROPERTIES FOR 3D TSV PACKAGES
Document Type and Number:
WIPO Patent Application WO/2023/004041
Kind Code:
A3
Abstract:
The disclosure relates to compositions for forming films and the use of said films in three-dimension through-silicon-via (3D TSV) packages. In certain aspects, the disclosure relates to compositions comprising one or more resins, one or more imidazoles with latent thermal activity, one or more inorganic fillers, and one or more additives, to B-stage films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions.
Inventors:
BAI JIE (US)
JANG JAMES SUNGWOOK (KR)
ZHUO QIZHUO (US)
SHIM KYU CHANG (US)
JANG JAMES SUNGWOOK (KR)
ZHUO QIZHUO (US)
SHIM KYU CHANG (US)
Application Number:
PCT/US2022/037878
Publication Date:
May 04, 2023
Filing Date:
July 21, 2022
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL IP & HOLDING GMBH (DE)
BAI JIE (US)
HENKEL IP & HOLDING GMBH (DE)
BAI JIE (US)
International Classes:
C08K5/3445; C08J5/18; C08K3/013; C08L29/12; C08L35/02; C08L65/00
Foreign References:
| US20100063184A1 | 2010-03-11 | |||
| US20100206623A1 | 2010-08-19 | |||
| CN107353837B | 2020-12-29 | |||
| CN107540797B | 2020-12-15 | |||
| US20130056686A1 | 2013-03-07 |
Attorney, Agent or Firm:
BAUMAN, Steven C. et al. (US)
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