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Patent Searching and Data


Title:
RESIN COMPOSITION FOR OPTICAL COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2016/076257
Kind Code:
A1
Abstract:
Provided are: a resin composition for optical components, which provides a cured product that has high pencil hardness comparable to that of glass, while having excellent bending strength and excellent mold releasability suitable for molding; and an optical component such as a resin lens, which is obtained by molding the composition. The present invention is a resin composition for optical components, which contains: 15-65 parts by weight of a ladder and/or random silsesquioxane derivative (a) having a 2-(3,4-epoxycyclohexyl)ethyl group and a weight average molecular weight of 2,000-10,000, said silsesquioxane derivative (a) being a hydrolysis-condensation product of a trialkoxysilane having a 2-(3,4-epoxycyclohexyl)ethyl group; an alicyclic skeleton-containing epoxy resin (b) in such an amount that the total of this component and the component (a) is 100 parts by weight; and 0.01-5 parts by weight of a curing agent.

Inventors:
KANAYA SHINGO (JP)
Application Number:
PCT/JP2015/081460
Publication Date:
May 19, 2016
Filing Date:
November 09, 2015
Export Citation:
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Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C08G59/32; C08G77/14; C08L63/00; C08L83/04; G02B1/04
Foreign References:
JP2006104248A2006-04-20
JP2006104249A2006-04-20
JP2012116989A2012-06-21
JP2007238868A2007-09-20
Attorney, Agent or Firm:
FURUTANI, Shinya (JP)
Shin-ya Furuya (JP)
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