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Title:
RESIN COMPOSITION FOR OPTICAL THREE-DIMENSIONAL MOLDING
Document Type and Number:
WIPO Patent Application WO/2015/068820
Kind Code:
A1
Abstract:
[Problem] To provide a resin composition for optical three-dimensional molding which makes it possible to produce a three-dimensional molded article exhibiting a low degree of yellowing, high light transmittance, low water and moisture absorption, and excellent impact resistance. [Solution] A resin composition for optical three-dimensional molding containing a radical polymerizable organic compound (A), a cationic polymerizable organic compound (B), a radical polymerization initiator (C), and a cationic polymerization initiator (D), the resin composition containing: polyalkylene glycol di(meth)acrylate (A-1) having a mean molecular weight of 300-2000 as part of the radical polymerizable organic compound (A); an alicyclic diglycidyl ether compound (B-1) represented by general formula (B-1) (In the formula, R1 represents a hydrogenated bisphenol A residue, a hydrogenated bisphenol E residue, a hydrogenated bisphenol F residue, a hydrogenated bisphenol AD residue, a hydrogenated bisphenol Z residue, a cyclohexane dimethanol residue, or a tricyclodecane dimethanol residue.) as part of the cationic polymerizable organic compound (B); and an oxetane compound (B-2) as another part of the cationic polymerizable organic compound (B).

Inventors:
OGANE NOBUO (JP)
NAKAMOTO EIJI (JP)
HONMA CHIHARU (JP)
DAICHO YUYA (JP)
Application Number:
PCT/JP2014/079647
Publication Date:
May 14, 2015
Filing Date:
November 07, 2014
Export Citation:
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Assignee:
CMET INC (JP)
International Classes:
C08G59/24; B29C67/00; C08F2/50; C08F20/26; C08G65/18
Foreign References:
JP2004530773A2004-10-07
JP2009203306A2009-09-10
JP2010174104A2010-08-12
JP2014008765A2014-01-20
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
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