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Patent Searching and Data


Title:
RESIN COMPOSITION FOR OPTICAL THREE-DIMENSIONAL MOLDING
Document Type and Number:
WIPO Patent Application WO/2018/043512
Kind Code:
A1
Abstract:
Provided is a resin composition for optical three-dimensional molding of which it is possible to improve the flexibility, toughness, and impact resistance without compromising the physical properties such as strength, rigidity, and heat resistance of a three-dimensional molded article obtained by optical molding. This resin composition for optical three-dimensional molding contains (A) a cationic polymerizable organic compound and/or radical polymerizable organic compound, and (B) a polyrotaxane compound having a cyclic molecule, an axial molecule penetrating the cyclic molecule, and blocking groups that are disposed at both ends of the axial molecule and that prevent elimination of the cyclic molecule.

Inventors:
YAMAMOTO Hiroshi (7-9 Hirakawacho 2-chome, Chiyoda-k, Tokyo 93, 〒1020093, JP)
Application Number:
JP2017/031026
Publication Date:
March 08, 2018
Filing Date:
August 29, 2017
Export Citation:
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Assignee:
NABTESCO CORPORATION (7-9 Hirakawacho 2-chome, Chiyoda-ku Tokyo, 93, 〒1020093, JP)
International Classes:
C08F2/48; B29C67/00; B33Y70/00; B33Y80/00; C08L101/00
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (Kyowa Patent & Law Office, Nippon Life Marunouchi Building 1-6-6, Marunouchi, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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