Title:
RESIN COMPOSITION FOR PATTERN FORMATION
Document Type and Number:
WIPO Patent Application WO/2014/203801
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition for pattern formation that makes it possible to produce a molded resin body having a long flow pattern that resembles the strokes of a sumi-e painting or a flow pattern that resembles marble by mixing the resin composition with a thermoplastic resin and molding the result. Provided is a resin composition for pattern formation that contains at least one coloring component that is selected from the group consisting of: reaction products of thermoplastic polyester resins and epoxy group-containing polymers; dyes; and pigments. The epoxy group-containing polymer preferably comprises glycidyl (meth)acrylate as a monomer unit, and it is preferable that the epoxy equivalent weight thereof be 150-7000.
Inventors:
MATSUMURA KAZUHIRO (JP)
ONO HIROKI (JP)
TANIGUCHI KAZUSHI (JP)
NAKASUKA TOSHIKAZU (JP)
INUI YUJI (JP)
ONO HIROKI (JP)
TANIGUCHI KAZUSHI (JP)
NAKASUKA TOSHIKAZU (JP)
INUI YUJI (JP)
Application Number:
PCT/JP2014/065602
Publication Date:
December 24, 2014
Filing Date:
June 12, 2014
Export Citation:
Assignee:
OK KASEI KK (JP)
International Classes:
C08L63/00; C08G59/02; C08L23/00; C08L25/04; C08L33/10; C08L55/02; C08L57/00
Foreign References:
| JPH10324736A | 1998-12-08 | |||
| JP2011252091A | 2011-12-15 | |||
| JP2007138054A | 2007-06-07 | |||
| JP2003119352A | 2003-04-23 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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