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Title:
RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM AND METHOD FOR PRODUCING SAME, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/199800
Kind Code:
A1
Abstract:
[Problem] To provide a resin composition which enables the formation of an insulating film that can exhibit excellent adhesion to a metal even under an extremely severe environment having a high temperature and a high humidity. [Solution] A resin composition comprising (A) an alkali-soluble resin and (C) a silane compound having at least one bond selected from a monosulfide bond, a polysulfide bond and a thiourea bond.

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Inventors:
HANAMURA MASAAKI (JP)
SAKURAI TOMOHIKO (JP)
MIZUNO HIKARU (JP)
Application Number:
PCT/JP2014/063696
Publication Date:
December 18, 2014
Filing Date:
May 23, 2014
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
C08L101/00; C08K5/548; C08L25/18; C08L61/10; G03F7/023; G03F7/038; G03F7/075; H05K3/28
Domestic Patent References:
WO2012053052A12012-04-26
WO2009057530A12009-05-07
Foreign References:
JP2008201873A2008-09-04
JP2010083956A2010-04-15
JPH09295988A1997-11-18
JPH09295989A1997-11-18
JPH09295991A1997-11-18
JPH09295992A1997-11-18
JP2009102512A2009-05-14
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
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