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Title:
RESIN COMPOSITION FOR PLATING USE AND RESIN PLATED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2010/061605
Kind Code:
A1
Abstract:
Disclosed is a resin composition for plating use, and a resin plated product, which have excellent plating adhesion strength, formability, shock resistance, and a low coefficient of linear expansion. This resin composition for plating use is characterized in that a graft copolymer (A), formed by graft polymerization of a specific monomeric component, and a specific copolymer (B), are included in a rubbery polymer (d) formed from a conjugated diene rubber, with the ratio of the rubbery polymer (d) being 10-20 mass% with respect to a total mass% of 100 for the graft copolymer (A) and copolymer (B), and with 1-8 parts by mass of an oxidation inhibitor (C) with a melting point of 25-100°C blended with respect to a total of 100 parts by mass of the graft copolymer (A) and copolymer (B).

Inventors:
SAKAI HIROSHI (JP)
YAMASHITA SHINJI (JP)
Application Number:
PCT/JP2009/006388
Publication Date:
June 03, 2010
Filing Date:
November 26, 2009
Export Citation:
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Assignee:
UMG ABS LTD (JP)
SAKAI HIROSHI (JP)
YAMASHITA SHINJI (JP)
International Classes:
C08L51/04; C08K5/00; C08L25/12; C25D5/56
Foreign References:
JP2008013731A2008-01-24
JP2007161940A2007-06-28
JPH10130485A1998-05-19
JP2000190328A2000-07-11
JP2005298899A2005-10-27
JP2003082138A2003-03-19
JP2008302399A2008-12-18
JPH0711487A1995-01-13
JPH01161425A1989-06-26
JP2005336614A2005-12-08
JP2007100174A2007-04-19
JP2007327131A2007-12-20
JP2008031513A2008-02-14
Other References:
See also references of EP 2351791A4
Attorney, Agent or Firm:
SHIGA, Masatake et al. (JP)
Masatake Shiga (JP)
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