Title:
RESIN COMPOSITION AND POLYMER COMPOSITE PIEZOELECTRIC BODY
Document Type and Number:
WIPO Patent Application WO/2021/059782
Kind Code:
A1
Abstract:
Provided are a polymer composite piezoelectric body having high piezoelectric properties, and a resin composition for manufacturing said polymer composite piezoelectric body. The present invention pertains to: a resin composition containing a polymer, a first fibrous piezoelectric filler, and a second fibrous piezoelectric filler, wherein an average fiber diameter D1 of the first fibrous piezoelectric filler and an average fiber diameter D2 of the second fibrous piezoelectric filler satisfy the relationship D1 < D2, and the proportions (volume ratio) of the first fibrous piezoelectric filler and the second fibrous piezoelectric filler are in a range of 10:90 to 80:20; and a polymer composite piezoelectric body formed from said resin composition.
Inventors:
UMEBAYASHI YOU (JP)
Application Number:
PCT/JP2020/030451
Publication Date:
April 01, 2021
Filing Date:
August 07, 2020
Export Citation:
Assignee:
JNC CORP (JP)
International Classes:
C08L101/00; C08K3/013; C08K3/24; H01L41/193; H01L41/257; H01L41/313; H04R17/00
Domestic Patent References:
| WO2014058077A1 | 2014-04-17 |
Foreign References:
| JP2013051252A | 2013-03-14 | |||
| JPH02167823A | 1990-06-28 | |||
| JP2003082523A | 2003-03-19 | |||
| JPS63260822A | 1988-10-27 |
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