Title:
RESIN COMPOSITION, AND PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/125817
Kind Code:
A1
Abstract:
The present invention relates to a resin composition, and a preparation method therefor and an application thereof. The resin composition comprises the following raw material components in parts by mass: 10-30 parts of hydrocarbon resin prepolymer, 50-100 parts of bismaleimide resin, 30-80 parts of cyanate ester resin, 5-30 parts of functional resin, 10-60 parts of inorganic filler and 10-20 parts of flame retardant; the hydrocarbon resin prepolymer is prepared by means of the pre-polymerization of allyl benzoxazine and a hydrocarbon resin. According to the present invention, the hydrocarbon resin prepolymer is prepared by means of allyl benzoxazine and the hydrocarbon resin, and is further reasonably proportioned with the bismaleimide resin and the remaining components, so that the compatibility of the hydrocarbon resin and the bismaleimide resin in the prepared resin composition is improved; the resin composition is used as a circuit board substrate, so that the dielectric loss and the dielectric constant of a material can be effectively reduced, and meanwhile, a relatively high peel strength is also achieved.
Inventors:
GUO YONGJUN (CN)
WEN WENYAN (CN)
XIAO HAO (CN)
WEN WENYAN (CN)
XIAO HAO (CN)
Application Number:
PCT/CN2022/143422
Publication Date:
July 06, 2023
Filing Date:
December 29, 2022
Export Citation:
Assignee:
GUANGDONG HINNO TECH CO LTD (CN)
International Classes:
C08L79/08; C08L61/34
Foreign References:
| CN114058181A | 2022-02-18 | |||
| CN112210210A | 2021-01-12 | |||
| CN113637133A | 2021-11-12 | |||
| CN104845363A | 2015-08-19 | |||
| CN107987471A | 2018-05-04 | |||
| CN111072980A | 2020-04-28 | |||
| CN112824452A | 2021-05-21 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
Download PDF: