Title:
RESIN COMPOSITION, PREPREG, RESIN-ADDED FILM, RESIN-ADDED METAL FOIL, METAL-CLAD LAYERED PLATE, AND WIRING PLATE
Document Type and Number:
WIPO Patent Application WO/2019/208471
Kind Code:
A1
Abstract:
In one aspect, the present invention is a resin composition characterized by the inclusion of: a compound (A) having within a molecule at least one group represented by formula (1); a cross-linking curing agent (B); and an azo compound (C) having within a molecule an azo group and having no heteroatom other than the nitrogen atom constituting the azo group. In the formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represents a hydrogen atom or an alkyl group.
Inventors:
SATO MIKIO
FUJIWARA HIROAKI
KITAI YUKI
KODA MASASHI
HOSHINO YASUNORI
OZEKI TAKAYOSHI
FUJIWARA HIROAKI
KITAI YUKI
KODA MASASHI
HOSHINO YASUNORI
OZEKI TAKAYOSHI
Application Number:
PCT/JP2019/016952
Publication Date:
October 31, 2019
Filing Date:
April 22, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B3/14; C08F290/06; B32B15/08; B32B27/06; C08F257/00; C08F290/12; C08J5/24; H05K1/03
Domestic Patent References:
| WO2016104748A1 | 2016-06-30 | |||
| WO2010067683A1 | 2010-06-17 |
Foreign References:
| JP2006516297A | 2006-06-29 | |||
| JP2016113543A | 2016-06-23 | |||
| JP2017128718A | 2017-07-27 | |||
| JP2018039995A | 2018-03-15 | |||
| JP2015218270A | 2015-12-07 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
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