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Title:
RESIN COMPOSITION, PREPREG, RESIN-ATTACHED FILM, RESIN-ATTACHED METAL FOIL, METAL-CLADDED LAMINATE SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/121734
Kind Code:
A1
Abstract:
A resin composition comprises an epoxy compound, a maleimide compound, a phenol compound, a core-shell rubber and an inorganic filler. The maleimide compound has an N-phenylmaleimide structure. The content of the maleimide compound is 10 parts by mass or more and less than 40 parts by mass relative to 100 parts by mass, i.e. the total amount, of the epoxy compound, the maleimide compound and the phenol compound.

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Inventors:
MUGURUMA TOMO
TAKAHASHI RYUJI
OBATA SHIMPEI
AMBE YASUNORI
Application Number:
PCT/JP2019/044794
Publication Date:
June 18, 2020
Filing Date:
November 15, 2019
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B27/20; B32B15/088; B32B27/34; C08G59/18; C08K3/36; C08K5/13; C08L39/04; C08L63/00
Domestic Patent References:
WO2017183621A12017-10-26
Foreign References:
JP2016044208A2016-04-04
JP2014037485A2014-02-27
JP2016190928A2016-11-10
JP2015063040A2015-04-09
JP2016074849A2016-05-12
JP2018053092A2018-04-05
JPH0697324A1994-04-08
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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