Title:
RESIN COMPOSITION, PREPREG, RESIN-ATTACHED FILM, RESIN-ATTACHED METAL FOIL, METAL-CLADDED LAMINATE SHEET, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/262089
Kind Code:
A1
Abstract:
One embodiment of the present invention is a resin composition that contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in each molecule, and a phosphorus-containing compound having a group represented by formula (1) and a phosphorous-atom-including group in each molecule. In formula (1), R1 represents a hydrogen atom or an alkyl group.
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Inventors:
YAMADA TAKAHIRO
FUJISAWA HIROYUKI
YAMADA YUJI
FUJISAWA HIROYUKI
YAMADA YUJI
Application Number:
PCT/JP2020/023471
Publication Date:
December 30, 2020
Filing Date:
June 15, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B27/00; B32B15/08; C08F290/06; C08J5/24; H05K1/03
Domestic Patent References:
| WO2018124205A1 | 2018-07-05 | |||
| WO2018159080A1 | 2018-09-07 |
Foreign References:
| JP2002308948A | 2002-10-23 | |||
| JP2007191675A | 2007-08-02 | |||
| JP2009161725A | 2009-07-23 | |||
| JP2019120081A | 2019-07-22 |
Other References:
See also references of EP 3978240A4
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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