RESIN COMPOSITION, PREPREG, FILM PROVIDED WITH RESIN, METALLIC FOIL PROVIDED WITH RESIN, METAL CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2020/066210

A1

This resin composition contains: an epoxy resin; a curing agent; a phenoxy resin having a weight average molecular weight in a range of 30,000-100,000; a surface conditioner; and a defoaming agent. The surface conditioner contains a polyether-modified polydimethylsiloxane. The defoaming agent contains an acrylic copolymer.

JPS5622345	AQUEOUS DISPERSION MADE OF MICROPARTICULAR PLASTIC* AND METHOD OF ELECTRODEPOSITING CATIONIC SYNTHETIC RESIN TOGETHER WITH MICROPARTICULAR NONIONIC PLASTIC ELECTROPHORETICALLY
JP2001240687	PREPREG AND LAMINATED BOARD CLAD WITH METALLIC FOIL
WO/2002/008338	INSULATING RESIN COMPOSITION FOR MULTILAYER PRINTED WIRING BOARDS, MULTILAYER PRINTED WIRING BOARDS MADE BY USING THE COMPOSITION AND PROCESS FOR THE PRODUCTION THEREOF

OTSUKA AKIRA
YAMAUCHI AKIHIRO
SHINPO TAKASHI
FUJISAWA HIROYUKI
NAKAMURA YOSHIHIKO

PCT/JP2019/026872

April 02, 2020

July 05, 2019

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PANASONIC IP MAN CO LTD (JP)

C08L63/00; B32B15/08; B32B27/38; C08J5/24; C08L33/04; C08L71/02; C08L83/12; H05K1/03; H05K3/46

WO2014175244A1	2014-10-30
WO2008087972A1	2008-07-24

JP2017193691A	2017-10-26
JP2016017090A	2016-02-01
JP2002172736A	2002-06-18
JP2011068788A	2011-04-07
JPH10265648A	1998-10-06
JP2013028713A	2013-02-07
JP2018177906A	2018-11-15

KAMATA Kenji et al. (JP)

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