Title:
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/010432
Kind Code:
A1
Abstract:
One aspect of the present invention is a resin composition which contains: a first styrene block copolymer having a hardness of from 20 to 70; a polyphenylene ether compound having at least one of a group represented by formula (1) and a group represented by formula (2) in each molecule; and a curing agent. In formula (1), p represents a number from 0 to 10; Z represents an arylene group; and each of R1 to R3 independently represents a hydrogen atom or an alkyl group. In formula (2), R4 represents a hydrogen atom or an alkyl group.
Inventors:
SAITO HIROSUKE
WANG YIQUN
INOUE HIROHARU
WANG YIQUN
INOUE HIROHARU
Application Number:
PCT/JP2020/027605
Publication Date:
January 21, 2021
Filing Date:
July 16, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B27/00; B32B3/14; B32B15/082; B32B27/30; C08F287/00; C08F299/02; C08J5/24
Domestic Patent References:
| WO2014148155A1 | 2014-09-25 |
Foreign References:
| JP2014086591A | 2014-05-12 | |||
| JP2010111758A | 2010-05-20 | |||
| US20140349090A1 | 2014-11-27 | |||
| JP2019172725A | 2019-10-10 | |||
| JP2018095815A | 2018-06-21 | |||
| JP2001196729A | 2001-07-19 | |||
| JPH05306366A | 1993-11-19 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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