Title:
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/018946
Kind Code:
A1
Abstract:
An aspect of the present invention pertains to a resin composition comprising: a polyphenylene ether compound (A) having a hydroxyl group in a molecule; a polyphenylene ether compound (B) having an unsaturated double bond in a molecule; a reactive compound (C) including at least one selected from among a maleimide compound (C1) and a benzoxazine compound (C2); and an inorganic filling material (D), wherein the content of the polyphenylene ether compound (A) is 1-50 parts by mass (exclusive of 50) with respect to 100 parts by mass of the total of the polyphenylene ether compound (A) and the polyphenylene ether compound (B).
Inventors:
OGUSHI HAJIME
OTSUKA AKIRA
FUJISAWA HIROYUKI
NAKASHIMA TAICHI
HIRONO HAYATE
OTSUKA AKIRA
FUJISAWA HIROYUKI
NAKASHIMA TAICHI
HIRONO HAYATE
Application Number:
PCT/JP2023/025509
Publication Date:
January 25, 2024
Filing Date:
July 10, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L71/12; B32B5/28; B32B15/08; C08J5/04; C08K3/013; C08K5/3415; C08K5/357
Domestic Patent References:
| WO2019188189A1 | 2019-10-03 | |||
| WO2021157249A1 | 2021-08-12 | |||
| WO2019138992A1 | 2019-07-18 | |||
| WO2015152427A1 | 2015-10-08 |
Foreign References:
| JP2021152107A | 2021-09-30 | |||
| JP2017206578A | 2017-11-24 | |||
| JP2020169273A | 2020-10-15 | |||
| JP2021138802A | 2021-09-16 | |||
| JP2021109944A | 2021-08-02 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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