Title:
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/057803
Kind Code:
A1
Abstract:
One aspect of the present invention relates to a resin composition comprising a radically polymerizable compound (A) that has a carbon-carbon unsaturated double bond in each molecule, a phosphate ester compound (B) that has an alicyclic hydrocarbon structure in each molecule, and an inorganic filler (C), wherein a cured product of said resin composition has a thermal conductivity of not less than 1.0W/m･K.
Inventors:
SATO MIKIO
KATSUTA SHINICHI
KATSUTA SHINICHI
Application Number:
PCT/JP2023/029463
Publication Date:
March 21, 2024
Filing Date:
August 14, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F290/06; C08J5/24; C08K3/013; C08K5/521
Domestic Patent References:
| WO2021079900A1 | 2021-04-29 | |||
| WO2022014582A1 | 2022-01-20 | |||
| WO2022014584A1 | 2022-01-20 | |||
| WO2019012954A1 | 2019-01-17 | |||
| WO2023119805A1 | 2023-06-29 | |||
| WO2022259851A1 | 2022-12-15 |
Foreign References:
| JP2011084657A | 2011-04-28 | |||
| JP2019021829A | 2019-02-07 | |||
| JP2009173855A | 2009-08-06 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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