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Title:
RESIN COMPOSITION, PREPREG, RESIN-INCLUDING FILM, RESIN-INCLUDING METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/131306
Kind Code:
A1
Abstract:
Provided is a resin composition containing a maleimide compound represented by formula (1), a modified polyphenylene ether compound in which the ends are modified by a substituent having a carbon-carbon unsaturated double bond, and a crosslinking agent containing an allyl compound. In formula (1), s represents 1-5, RA, RB, RC, and RD each independently represent a hydrogen atom, an alkyl group having 1-5 carbon atoms, or a phenyl group.

Inventors:
TOSHIMITSU, Kenichi
NAKAMURA, Yoshihiko
FUJISAWA, Hiroyuki
TUMURAYA, Yuuji
YAMAUCHI, Akihiro
SHINPO, Takashi
Application Number:
JP2018/046471
Publication Date:
July 04, 2019
Filing Date:
December 18, 2018
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
C08F290/06; B32B27/00; C08J5/24; H05K1/03; C08G65/48
Domestic Patent References:
WO2015064064A12015-05-07
WO2017006891A12017-01-12
WO2017170551A12017-10-05
WO2016072404A12016-05-12
WO2018159080A12018-09-07
Foreign References:
US20170166729A12017-06-15
JP2009001783A2009-01-08
JP2017137492A2017-08-10
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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