Title:
RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/033131
Kind Code:
A1
Abstract:
The present invention relates to: a resin composition comprising (A) a heat-curable resin, (B) a poly(phenylene ether)-based resin, (C) an alkoxysilane compound having a primary amino group, and (D) an inorganic filler; and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package each obtained using the resin composition.
Inventors:
FUJII TOSHIKI (JP)
SHIMOKAWA RYO (JP)
HIDAKA YOSHIKI (JP)
YANAGIDA MAKOTO (JP)
NAKAMURA YUKIO (JP)
SHIMOKAWA RYO (JP)
HIDAKA YOSHIKI (JP)
YANAGIDA MAKOTO (JP)
NAKAMURA YUKIO (JP)
Application Number:
PCT/JP2022/033057
Publication Date:
March 09, 2023
Filing Date:
September 02, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L35/00; C08J5/04; C08K3/013; C08K5/544; C08L71/12
Domestic Patent References:
| WO2021149733A1 | 2021-07-29 |
Foreign References:
| JP2014101398A | 2014-06-05 | |||
| JP2017057346A | 2017-03-23 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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