Title:
RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/224021
Kind Code:
A1
Abstract:
The present invention provides: a resin composition which contains (A) one or more substances that are selected from the group consisting of maleimide resins having one or more N-substituted maleimide groups and derivatives of the maleimide resins and (B) a compound that has a vinylbenzyl group, wherein the component (B) contains one or more compounds that are selected from the group consisting of (B1) compounds having three or more vinylbenzyl groups which are each bonded to an oxygen atom and (B2) compounds having one or more vinylbenzyl groups which are each bonded to a carbon atom; a prepreg which uses this resin composition; a laminate; a resin film; a printed wiring board; and a semiconductor package.
Inventors:
YAMASHITA TAKESHI (JP)
KOTAKE TOMOHIKO (JP)
KOTAKE TOMOHIKO (JP)
Application Number:
PCT/JP2023/018197
Publication Date:
November 23, 2023
Filing Date:
May 16, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08F212/00; B32B15/08; C08F222/40; C08F290/14; C08J5/18; C08J5/24; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
| WO2019208129A1 | 2019-10-31 |
Foreign References:
| JP2003306591A | 2003-10-31 | |||
| JPS6465110A | 1989-03-10 | |||
| JP2015189926A | 2015-11-02 | |||
| JP2005325197A | 2005-11-24 | |||
| JP2003277440A | 2003-10-02 | |||
| JP2003283076A | 2003-10-03 | |||
| JP2007154200A | 2007-06-21 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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